Semiconductor device and method of manufacturing a semiconductor device

ABSTRACT

In one example, a semiconductor device can comprise (a) an electronic device comprising a device top side, a device bottom side opposite the device top side, and a device sidewall between the device top side and the device bottom side, (b) a first conductor comprising, a first conductor side section on the device sidewall, a first conductor top section on the device top side and coupled to the first conductor side section, and a first conductor bottom section coupled to the first conductor side section, and (c) a protective material covering the first conductor and the electronic device. A lower surface of the first conductor top section can be higher than the device top side, and an upper surface of the first conductor bottom section can be lower than the device top side. Other examples and related methods are also disclosed herein.

TECHNICAL FIELD

The present disclosure relates, in general, to electronic devices, andmore particularly, to semiconductor devices and methods formanufacturing semiconductor devices.

BACKGROUND

Prior semiconductor packages and methods for forming semiconductorpackages are inadequate, for example resulting in excess cost, decreasedreliability, relatively low performance, or package sizes that are toolarge. Further limitations and disadvantages of conventional andtraditional approaches will become apparent to one of skill in the art,through comparison of such approaches with the present disclosure andreference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a cross-sectional view of an example semiconductor device.

FIGS. 2A to 2H show cross-sectional views of an example method formanufacturing an example semiconductor device.

The following discussion provides various examples of semiconductordevices and methods of manufacturing semiconductor devices. Suchexamples are non-limiting, and the scope of the appended claims shouldnot be limited to the particular examples disclosed. In the followingdiscussion, the terms “example” and “e.g.” are non-limiting.

The figures illustrate the general manner of construction, anddescriptions and details of well-known features and techniques may beomitted to avoid unnecessarily obscuring the present disclosure. Inaddition, elements in the drawing figures are not necessarily drawn toscale. For example, the dimensions of some of the elements in thefigures may be exaggerated relative to other elements to help improveunderstanding of the examples discussed in the present disclosure. Thesame reference numerals in different figures denote the same elements.

The term “or” means any one or more of the items in the list joined by“or”. As an example, “x or y” means any element of the three-element set{(x), (y), (x, y)}. As another example, “x, y, or z” means any elementof the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y,z)}.

The terms “comprises,” “comprising,” “includes,” and/or “including,” are“open ended” terms and specify the presence of stated features, but donot preclude the presence or addition of one or more other features.

The terms “first,” “second,” etc. may be used herein to describe variouselements, and these elements should not be limited by these terms. Theseterms are only used to distinguish one element from another. Thus, forexample, a first element discussed in this disclosure could be termed asecond element without departing from the teachings of the presentdisclosure.

Unless specified otherwise, the term “coupled” may be used to describetwo elements directly contacting each other or describe two elementsindirectly connected by one or more other elements. For example, ifelement A is coupled to element B, then element A can be directlycontacting element B or indirectly connected to element B by anintervening element C. Similarly, the terms “over” or “on” may be usedto describe two elements directly contacting each other or describe twoelements indirectly connected by one or more other elements.

DESCRIPTION

In one example, a semiconductor device can comprise (a) an electronicdevice comprising a device top side comprising a device first terminal,a device bottom side opposite the device top side, and a device firstsidewall between the device top side and the device bottom side, and (b)a substrate. The substrate can comprise a dielectric material comprising(a) a dielectric top section over the device top side, wherein thedielectric top section comprises a dielectric first opening over thedevice first terminal (b) a dielectric side section over the devicefirst sidewall and continuous with the dielectric top section, and (c) adielectric bottom section comprising a lower surface substantiallycoplanar with the device bottom side and continuous with the dielectricside section. The substrate can also comprise a first conductivematerial comprising (a) a first conductive top section over thedielectric top section and coupled to the device first terminal throughthe dielectric first opening, (b) a first conductive side section overthe dielectric side section and continuous with the first conductive topsection, and (c) a first conductive bottom section over the dielectricbottom section and continuous with the first conductive side section.

In one example, a semiconductor device can comprise (a) an electronicdevice comprising a device top side, a device bottom side opposite thedevice top side, and a device sidewall between the device top side andthe device bottom side, (b) a first conductor comprising, a firstconductor side section on the device sidewall, a first conductor topsection on the device top side and coupled to the first conductor sidesection, and a first conductor bottom section coupled to the firstconductor side section, and (c) a protective material covering the firstconductor and the electronic device. A lower surface of the firstconductor top section can be higher than the device top side, and anupper surface of the first conductor bottom section can be lower thanthe device top side.

In one example, a method can comprise (a) providing an electronic devicecomprising a device top side comprising a device first terminal, adevice bottom side opposite the device top side, and a device firstsidewall between the device top side and the device bottom side, and (b)providing a dielectric comprising a dielectric top section over thedevice top side, wherein the dielectric top section comprises adielectric first opening over the device first terminal, a dielectricside section over the device first sidewall and continuous with thedielectric top section, and a dielectric bottom section continuous withthe dielectric side section. A lower surface of the dielectric bottomsection can be substantially coplanar with the device bottom side. Anupper surface of the dielectric bottom section can be lower than anupper surface of the dielectric top section.

Other examples are included in the present disclosure. Such examples maybe found in the figures, in the claims, and/or in the description of thepresent disclosure.

FIG. 1 shows a cross-sectional view of an example semiconductor device100. In the example shown in FIG. 1, semiconductor device 100 cancomprise electronic device 110, electronic component 130, substrates 120and 140, interconnects 150 and 170, and an encapsulant 160.

Electronic device 110 can comprise terminals 111. Terminals 111 can beformed on a top surface of electronic device 110. Substrate 120 cancomprise a dielectric structure 121 and a conductive structure 122.Conductive structure 122 can be electrically connected to terminals 111of electronic device 110.

Electronic component 130 can comprise terminals 131. Terminals 131 canbe formed on a bottom surface of electronic component 130. Substrate 140can comprise a dielectric structure 141 and a conductive structure 142.Conductive structure 142 can be electrically connected to terminals 131of electronic component 130. Substrate 140 can be formed on the bottomsurface of electronic component 130.

Interconnects 150 can be formed of a conductive material and canelectrically connect conductive structure 142 and conductive structure122. Interconnects 170 can be formed of a conductive material and can beformed on the bottom surface of substrate 140. Interconnects 170 can beelectrically connected to conductive structure 142. Encapsulant 160 canbe interposed between the top surface of substrate 120 and the bottomsurface of substrate 140.

Substrates 120 and 140, interconnects 150 and 170, and encapsulant 160can comprise or be referred to as a semiconductor package 101, which canprovide protection for electronic device 110 and electronic component130 from external elements and/or environmental exposure. In addition,semiconductor package 101 can provide electrical coupling betweenexternal electrical components and terminals 111 and 131.

FIGS. 2A to 2H show cross-sectional views of an example method formanufacturing semiconductor device 100.

FIG. 2A shows a cross-sectional view of semiconductor device 100 at anearly stage of manufacture. In the example shown in FIG. 2A, electronicdevice 110 can be mounted on a top surface 10 a of carrier 10. Here, aportion of the top surface 10 a of carrier 10 can be exposed. Examplesof carrier 10 can comprise silicon, low grade silicon, glass, siliconcarbide, sapphire, quartz, ceramic, metal oxide, metal and so on.

A device bottom side 110 b of electronic device 110 can be secured tothe top surface 10 a of carrier 10, for example, using an adhesivebetween device bottom side 110 b and top surface 10 a. In some examples,the adhesive can be a liquid-phase epoxy adhesive, an adhesive film, oran adhesive tape.

In some examples, electronic device 110 can comprise or be referred toas an electronic component, a semiconductor die, or a semiconductorpackage. Electronic device 110 can comprise, for example, asemiconductor material, such as silicon (Si). Electronic device 110 cancomprise a plurality of terminals 111 provided on its device top side110 a. Electronic device 110 can comprise passive electronic circuitsand/or or active electronic circuits, such as transistors. Electronicdevice 110 can have a thickness in the range from approximately 75 μm toapproximately 775 μm. Carrier 10 can facilitate handling of electronicdevice 110 in the following manufacturing process and can protectelectronic device 110.

In some examples, terminals 111 can comprise or be referred to as diepads. Terminals 111 can comprise, for example, electrically conductivematerials, such as a metallic material, aluminum, copper, an aluminumalloy or a copper alloy.

FIG. 2B shows a cross-sectional view of semiconductor device 100 at alater stage of manufacture. In the example shown in FIG. 2B, dielectricstructure 121 can be formed to cover the top surface 10 a of carrier 10and the exposed surface of electronic device 110 to a substantiallyuniform thickness. Dielectric structure 121 comprises substantiallyhorizontal dielectric top section 121 a over device top side 110 a,substantially horizontal dielectric bottom section 121 b extending overcarrier 10 or device bottom plane 110 p, and substantially verticaldielectric side section 121 c over device sidewall 110 c. Device bottomplane 110 p can be defined by device bottom side 110 b. An upper surfaceof dielectric bottom section 121 b can be exposed from dielectric topsection 121 a. A lower surface of dielectric bottom section 121 b can besubstantially coplanar with device bottom side 110 b. An upper surfaceof dielectric bottom section 121 b can be lower than an upper surface ofdielectric top section 121 a, or lower than a lower surface ofdielectric top section 121 a. Dielectric top section 121 a anddielectric bottom section 121 b can each be connected or continuous withdielectric side section 121 c. Dielectric 121 can be applied or formedconformally to carrier 10 and electronic device 110, such as to acquireor conform to the contour or combined shape of electronic device 110 andcarrier 10.

Dielectric structure 121 can have a thickness in the range from 5 μm to10 μm. In some examples, dielectric structure 121 can comprise or bereferred to as a dielectric, a dielectric layer, a dielectric material,a non-conductive material, or an insulator. Dielectric structure 121 cancomprise, for example, an insulating material, such as a polymer,polyimide (PI), benzocyclobutene (BCB), polybenzoxazole (PBO),bismaleimide triazine (BT), a molding material, a phenolic resin, anepoxy, silicone, or an acrylate polymer. Examples for forming dielectricstructure 121 can comprise using spin coating, spray coating, printing,physical vapor deposition (PVD), chemical vapor deposition (CVD), metalorganic chemical vapor deposition (MOCVD), atomic layer deposition(ALD), low pressure chemical vapor deposition (LPCVD), plasma enhancedchemical vapor deposition (PECVD), sheet lamination, or evaporation.

FIG. 2C shows a cross-sectional view of semiconductor device 100 at alater stage of manufacture. In the example shown in FIG. 2C, openings121 x exposing terminals 111 can be formed by patterning dielectricstructure 121. Openings 121 y exposing a portion of the top surface 10 aof carrier 10 can also be formed at this stage. For example, afterforming a mask pattern that exposes regions of dielectric structure 121corresponding to openings 121 x and openings 121 y, such exposed regionsof dielectric structure 121 can be removed, such as by etching, therebyforming openings 121 x and openings 121 y. Photoresist can be used asmask pattern.

In some examples, openings 121 x and 121 y can comprise or be referredto as apertures or vias. Openings 121 x can have a smaller perimeterthan terminals 111. Accordingly, dielectric structure 121 can cover orremain over portions of outer perimeters of terminals 111. Openings 121y can have a planar size in the range from approximately 10 μm toapproximately 100 μm.

FIG. 2D shows a cross-sectional view of semiconductor device 100 at alater stage of manufacture. In the example shown in FIG. 2D, conductivestructure 122 can be formed to cover openings 121 x, openings 121 y andthe exposed surface of dielectric structure 121.

Conductive structure 122 can comprise or be referred to as one or moreconductive materials, conductors or conductive layers, patterns ortraces, such as conductors 122 x, 122 y, and 122 z. In the presentexample, conductors 122 x, 122 x, and 122 z can be formed from a singleconductive layer that can be defined by one or more conductive sublayerssuch as, for example, a principal sublayer over a seed sublayer.Conductors 122 x, 122 x, or 122 z can be similar to each other, and cancomprise respective conductor top sections, conductor side sections 122c, or conductor bottom sections 122 b adjacent respective sides ofelectronic device 110. Conductors 122 x and 122 y extend over device topside 110 a of electronic device 110, and each can have a first terminalportion connected to respective terminals 111 exposed through respectiveopenings 121 x. Conductor 122 x also has a second terminal portion thatis exposed and/or extends through respective opening 121 y of dielectricstructure 121. The first and second terminal portions of conductor 122 xare linked to each other by a conductive path of conductor 122 x.Conductor 122 x is on dielectric structure 121 and comprises conductortop section 122 a that extends substantially horizontally overdielectric top section 121 a and device top side 110 a, conductor sidesection 122 c that extends substantially vertically over dielectric sidesection 121 c and device sidewall 110 c, and conductor bottom section122 b that extends substantially horizontally past the perimeter ofelectronic device 110 over dielectric bottom section 121 b and overcarrier 10. Conductor top section 122 a and conductor bottom section 122b, can each be connected or continuous with conductor side section 122c. In some examples, conductor side section 122 c can be substantiallyorthogonal to conductor top section 122 a and to conductor bottomsection 122 b. In some examples, conductor top section 122 a andconductor bottom section 122 b do not substantially overlap each other.In some examples, an upper surface of conductor bottom section 122 b canbe closer to device bottom plane 110 p than a lower surface of conductortop section 122 a. In some examples, a lower surface of conductor topsection 122 a can be higher than device top side 110 a, and an uppersurface of conductor bottom section 122 b can be substantially parallelto the lower surface of conductor top section 122 a but lower thandevice top side 110 a.

Conductor 122 z also extends and has a first terminal portion overdevice top side 110 a of electronic device 110, but as shown in thepresent example conductor 122 z need not be connected to electronicdevice 110 or any terminal 111. Conductor 122 z also has a secondterminal portion that is exposed and/or extends through respectiveopening 121 y of dielectric structure 121. The first and second terminalportions of conductor 122 z are linked to each other by a conductivepath of conductor 122 z, where such conductive path is on dielectricstructure 121 and extends substantially horizontally over device topside 110 a of electronic device 110, substantially vertically overdevice sidewall 110 c of electronic device 110, and substantiallyhorizontally over carrier 10 further past the perimeter of electronicdevice 110.

Although the present example is illustrated for simplicity with a singleconductive structure 122 and a single dielectric structure 121, suchelements can respectively represent one or more conductive structures orlayers and/or one or more dielectric structures or layers that may bealternatingly stacked over each other. In the same or other examples,one or more portions of conductive structure 122 can have or can beformed with one or more layers of one or more conductive materialsstacked on each other.

Conductive structure 122 can have a thickness in the range fromapproximately 3 μm to approximately 10 μm. In some examples, conductivestructure 122 can comprise an electrically conductive material such as,for example, titanium (Ti), titanium-tungsten (TiW), copper (Cu), oralloys of Ti, TiW, or Cu.

Examples for forming conductive structure 122 can comprise usingphysical vapor deposition (PVD), chemical vapor deposition (CVD), atomiclayer deposition (ALD), plasma vapor deposition, electroless plating, orelectrolytic plating. In some examples, PVD can comprise or be referredto as sputtering.

Conductors 122 x, 122 y, or 122 z of conductive structure 122, or theirrespective conductor top sections 122 a, conductor side sections 122 c,or conductor bottom sections 122 b, can be applied or formedsimultaneously or conformally to carrier 10 and electronic device 110,such as to acquire or conform to the contour or combined shape ofdielectric 121, electronic device 110, or carrier 10.

FIG. 2E shows a cross-sectional view of semiconductor device 100 at alater stage of manufacture. In the example shown in FIG. 2E, electroniccomponent 130 having substrate 140 and internal interconnects 150 onbottom side 130 b of the electronic component 130 can be mounted onconductive structure 122. Electronic component 130 can comprise bereferred to as an electronic device, a semiconductor die, asemiconductor package, and/or an interposer. Electronic component 130can comprise, for example, a semiconductor material, such as silicon(Si). Electronic component 130 can comprises a plurality of terminals131 provided on its bottom side 130 b. Electronic component 130 cancomprise passive electronic circuits and/or active electronic circuitssuch as transistors. Electronic component 130 can have a thickness inthe range from approximately 75 μm to approximately 775 μm.

Substrate 140 and interconnects 150 can be further provided on thebottom side 130 b of electronic component 130. Substrate 140 cancomprise dielectric structure 141 covering bottom side 130 b ofelectronic component 130 and exposing terminals 131, and conductivestructure 142 electrically connected to terminals 131 exposed throughdielectric structure 141. In some examples, substrate 140, dielectricstructure 141, and/or conductive structure 142 can be similar tosubstrate 120, dielectric structure 121, and/or conductive structure122. Conductive structure 142 can have a plurality of conductors,patterns, or traces that extend over bottom side 130 b of electroniccomponent 130. For example, each of component conductors 142 x, 142 y,and 142 z can have a respective first terminal portion to which acorresponding interconnect 150 is coupled, a respective second terminalportion coupled to a corresponding terminal 131 of electronic component130 exposed through dielectric structure 141, and respective conductivepaths that link together the corresponding first and second terminalportions of each of conductors 142 x, 142 y, and 142 z. In the presentexample, respective interconnects 150 couple together conductor 142 x toconductor 122 x, conductor 142 y to conductor 122 y, and conductor 142 zto conductor 122 z. For instance, interconnect 1501 is coupled toconductor top section 122 a, and coupled to component terminal 1311through component conductor 142 x. In addition, component terminal 1311is coupled to device terminal 1111 through interconnect 1501, conductortop section 122 a, and dielectric opening 121 x. In the present example,component dielectric structure 141 is located on component bottom side130 b, leaving component terminal 1311 exposed, and conductor 142 xextends laterally from component terminal 1311 over component dielectricstructure 141 such that component terminal 1311 is laterally offset frominterconnect 1501. Furthermore, internal interconnect 1501 is coupledalong conductor top section 122 a, such that it is laterally offset fromdevice terminal 1111. In some examples, internal interconnects 150 canbe coupled to respective conductors of conductive structure 142, and/orto respective conductors of conductive structure 122, through respectiveterminals such as pads and/or under-bump metallization (UBM) formed onsuch respective conductors.

Conductive structure 142 that constitutes substrate 140 together withdielectric structure 141 can be a wiring for redistributing electricalconnections of terminals 131 of electronic component 130. Conductivestructure 142 can have a thickness in the range from approximately 3 μmto approximately 10 μm, and dielectric structure 141 can have athickness in the range from approximately 5 μm to approximately 10 μm.

Dielectric structure 141 can comprise or be referred to as, for example,one or more dielectric layers, non-conductive materials or insulators.Dielectric structure 141 can comprise, for example, an insulatingmaterial, such as a polymer, polyimide (PI), benzocyclobutene (BCB),polybenzoxazole (PBO), bismaleimide triazine (BT), a molding material, aphenolic resin, an epoxy, silicone, or an acrylate polymer. Examples forforming dielectric structure 141 can comprise using spin coating, spraycoating, printing, physical vapor deposition (PVD), chemical vapordeposition (CVD), metal organic chemical vapor deposition (MOCVD),atomic layer deposition (ALD), low pressure chemical vapor deposition(LPCVD), plasma enhanced chemical vapor deposition (PECVD), sheetlamination, or evaporation. In addition, dielectric structure 141 can beexposed by etching portions where terminals 131 of electronic component130 are formed.

In some examples, conductive structure 142 can comprise an electricallyconductive material such as, for example, titanium (Ti),titanium-tungsten (TiW), copper (Cu), or alloys of Ti, TiW, or Cu.Examples for forming conductive structure 142 can comprise usingphysical vapor deposition (PVD), chemical vapor deposition (CVD), atomiclayer deposition (ALD), plasma vapor deposition, electroless plating, orelectrolytic plating. In some examples, PVD can comprise or be referredto as sputtering. In addition, conductive structure 142 can be patternedusing a mask pattern to provide a plurality of patterns electricallyconnected to terminals 131, respectively.

Interconnects 150 can be electrically connected to the bottom surface142 b of conductive structure 142. Interconnects 150 can be equallysized. Interconnects 150 can comprise tin (Sn), silver (Ag), lead (Pb),copper (Cu), Sn—Pb, Sn37-Pb, Sn95-Pb, Sn—Pb—Ag, Sn—Cu, Sn—Ag, Sn—Au,Sn—Bi, or Sn—Ag—Cu. In some examples, interconnects 150 can comprise asolder ball, and/or a metal-core ball having a solid metal core coveredby solder. In some examples interconnects 150 can comprise a metallicpillar, such as a copper pillar, that can be placed or formed onconductive structure 142, and which may have a solder tip or end.Interconnects 150 can have a size in the range from approximately 5 μmto approximately 100 μm.

Examples for forming interconnects 150 include using a ball dropprocess, a screen-printing process, or an electroplating process. Insome examples, an electrically conductive material comprising solder canbe formed on bottom surface of conductive structure 142 using a solderball drop process. Here, the bottom surface 142 b of conductivestructure 142 can be disposed to face upward. A reflow process can beused to heat electronic component 130 and substrate 140 to apredetermined temperature and the shapes of interconnects 150 can changeduring the reflow.

In some examples, electronic component 130 having substrate 140 andinterconnects 150 can be electrically connected to conductive structure122 of substrate 120 using a mass reflow process, a thermal compressionprocess or a laser bonding process. Interconnects 150 can be interposedbetween conductive structure 122 and conductive structure 142 toelectrically connect substrate 120 and substrate 140. Interconnects 150can route electrical current or signals between electronic device 110and electronic component 130 through substrate 120 and substrate 140. Inaddition, one or more interconnects 150 can be connected to conductorsthat are not electrically connected to electronic device 110, such asconductor 122 z. In some examples, interconnects 150 can electricallyconnect electronic component 130 to electronic device 110 throughsubstrate 140 and substrate 120. In the same or other examples, one ormore interconnect 150 can electrically connect electronic component 130to a conductor of conductive structure 122 that extends past theperimeter of electronic device 110 that and is exposed through openings121 y of dielectric structure 121.

In some examples, one or more of the substrates that can be used as partof semiconductor device 100, such as substrate 140 or 120, can beredistribution layer (“RDL”) substrates. RDL substrates can comprise oneor more conductive redistribution layers and one or more dielectriclayers that (a) can be formed layer by layer over an electronic deviceto which the RDL substrate is to be electrically coupled, or (b) can beformed layer by layer over a carrier that can be entirely removed or atleast partially removed after the electronic device and the RDLsubstrate are coupled together. RDL substrates can be manufactured layerby layer as a wafer-level substrate on a round wafer in a wafer-levelprocess, and/or as a panel-level substrate on a rectangular or squarepanel carrier in a panel-level process. RDL substrates can be formed inan additive buildup process that can include one or more dielectriclayers alternatingly stacked with one or more conductive layers thatdefine respective conductive redistribution patterns or tracesconfigured to collectively (a) fan-out electrical traces outside thefootprint of the electronic device, and/or (b) fan-in electrical traceswithin the footprint of the electronic device. The conductive patternscan be formed using a plating process such as, for example, anelectroplating process or an electroless plating process. The conductivepatterns can comprise an electrically conductive material such as, forexample, copper or other plateable metal. The locations of theconductive patterns can be made using a photo-patterning process suchas, for example, a photolithography process and a photoresist materialto form a photolithographic mask. The dielectric layers of the RDLsubstrate can be patterned with a photo-patterning process, which caninclude a photolithographic mask through which light is exposed tophoto-pattern desired features such as vias in the dielectric layers.The dielectric layers can be made from photo-definable organicdielectric materials such as, for example, polyimide (PI),benzocyclobutene (BCB), or polybenzoxazole (PBO). Such dielectricmaterials can be spun-on or otherwise coated in liquid form, rather thanattached as a pre-formed film. To permit proper formation of desiredphoto-defined features, such photo-definable dielectric materials canomit structural reinforcers or can be filler-free, without strands,weaves, or other particles, that could interfere with the light from thephoto-patterning process. In some examples, such filler-freecharacteristics of filler-free dielectric materials can permit areduction of the thickness of the resulting dielectric layer. Althoughthe photo-definable dielectric materials described above can be organicmaterials, in other examples the dielectric materials of the RDLsubstrates can comprise one or more inorganic dielectric layers. Someexamples of inorganic dielectric layer(s) can comprise silicon nitride(Si₃N₄), silicon oxide (SiO₂), and/or SiON. The inorganic dielectriclayer(s) can be formed by growing the inorganic dielectric layers usingan oxidation or nitridization process instead using photo-definedorganic dielectric materials. Such inorganic dielectric layers can befiller-fee, without strands, weaves, or other dissimilar inorganicparticles. In some examples, the RDL substrates can omit a permanentcore structure or carrier such as, for example, a dielectric materialcomprising bismaleimide triazine (BT) or FR4 and these types of RDLsubstrates can be referred to as a coreless substrate. Other substratesin this disclosure can also comprise an RDL substrate.

In some examples, one or more of the substrates that can be used as partof semiconductor device 100, such as substrate 140, can be pre-formedsubstrates. The pre-formed substrate can be manufactured prior toattachment to an electronic device and can comprise dielectric layersbetween respective conductive layers. The conductive layers can comprisecopper and can be formed using an electroplating process. The dielectriclayers can be relatively thicker non-photo-definable layers that can beattached as a pre-formed film rather than as a liquid and can include aresin with fillers such as strands, weaves, and/or other inorganicparticles for rigidity and/or structural support. Since the dielectriclayers are non-photo-definable, features such as vias or openings can beformed by using a drill or laser. In some examples, the dielectriclayers can comprise a prepreg material or Ajinomoto Buildup Film (ABF).The pre-formed substrate can include a permanent core structure orcarrier such as, for example, a dielectric material comprisingbismaleimide triazine (BT) or FR4, and dielectric and conductive layerscan be formed on the permanent core structure. In other examples, thepre-formed substrate can be a coreless substrate which omits thepermanent core structure, and the dielectric and conductive layers canbe formed on a sacrificial carrier that is removed after formation ofthe dielectric and conductive layers and before attachment to theelectronic device. The pre-formed substrate can rereferred to as aprinted circuit board (PCB) or a laminate substrate. Such pre-formedsubstrate can be formed through a semi-additive ormodified-semi-additive process. Other substrates in this disclosure canalso comprise a pre-formed substrate.

FIG. 2F shows a cross-sectional view of semiconductor device 100 at alater stage of manufacture. In the example shown in FIG. 2F, encapsulant160 can be formed to cover the top of substrate 120, the bottom ofsemiconductor component 130 and substrate 140, electronic device 110,and interconnects 150. The sidewalls of electronic device 110, includingdevice sidewall 110 c, are at least partially bounded by encapsulant160. Encapsulant 160 can be provided to entirely fill the area betweensubstrate 120 and substrate 140.

In some examples, encapsulant 160 can comprise an electricallynon-conductive material, a resin, a polymer composite material, apolymer having a filler, an epoxy resin, an epoxy resin, an epoxyacrylate having a filler such as silica or other inorganic material, asilicone resin, or a resin-impregnated B-state pre-preg film.

Examples for forming encapsulant 160 can comprise compression molding,transfer molding, liquid encapsulant molding, vacuum lamination, pasteprinting, or film assisted molding. In some examples, encapsulant 160can comprise or be referred to as a protective material or a moldcompound. Encapsulant 160 can electrically disconnect substrate 120,substrate 140 and interconnects 150 from one another, thereby protectingsubstrate 120, substrate 140 and interconnects 150 from externalcircumferences.

FIG. 2G shows a cross-sectional view of semiconductor device 100 at alater stage of manufacture. In the example shown in FIG. 2G, carrier 10adhered to the device bottom side 110 b of electronic device 110 can beremoved to allow the device bottom side 110 b of electronic device 110and the bottom surface of substrate 120 to be exposed. As carrier 10 isremoved, the bottom surface 121 b of dielectric structure 121 formed onthe top surface 10 a of carrier 10 can be exposed. In addition, ifcarrier 10 is removed, conductive structure 122 formed on the topsurface 10 a of carrier 10 can also be exposed through openings 121 y ofdielectric structure 121. Conductors of conductive structure 122 whichare not electrically connected to electronic device 110, such asconductor 122 z, can also be exposed through openings 121 y.

Carrier 10 can be removed by general grinding or chemical etching.Alternatively, carrier 10 can also be removed by a release process usingUV radiation or laser.

FIG. 2H shows a cross-sectional view of semiconductor device 100 at alater stage of manufacture. In the example shown in FIG. 2H,interconnects 170 can be provided on conductive structure 122 exposedthrough openings 121 y.

Interconnects 170 can be electrically connected to the bottom surface ofconductive structure 122. In some examples, interconnects 170 can beelectrically connected to electronic device 110 through conductivestructure 122. In some examples, interconnects 170 can be electricallyconnected to electronic component 130 through conductive structure 122,interconnects 150 and conductive structure 142. Interconnects 170 can bereferred as external interconnects, permitting external connections fromsemiconductor device 100 to external devices or components such asprinted circuit boards or substrates.

Interconnects 170 can comprise tin (Sn), silver (Ag), lead (Pb), copper(Cu), Sn—Pb, Sn37-Pb, Sn95-Pb, Sn—Pb—Ag, Sn—Cu, Sn—Ag, Sn—Au, Sn—Bi, orSn—Ag—Cu. Examples for forming interconnects 170 include using a balldrop process, a screen-printing process, or an electroplating process.In some examples, an electrically conductive material comprising soldercan be formed on the bottom surface 122 b of conductive structure 122using a solder ball drop process. The bottom surface 122 b of conductivestructure 122 can be disposed to face upward at this stage. A reflowprocess can be used to heat semiconductor device 100 to a predeterminedtemperature and the shapes of interconnects 170 can change during thereflow process. Electrical interconnects 170 can comprise or be referredto as conductive balls, such as solder balls, conductive pillars, suchas copper pillars, or conductive posts having solder caps formed oncopper pillars. Interconnects 170 can have a size in the range fromapproximately 60 μm to approximately 150 μm.

Interconnects 170 can permit external access to and/or from one or moreelements of semiconductor device 100, such as electronic device 110and/or electronic component 130.

For example, in a first path adjacent sidewall 110 c of electronicdevice 110, interconnect 1701 on the bottom of substrate 120 is coupledto component terminal 1311 of electronic component 130 through a routethat includes conductor 122 x (including conductor bottom section 122 b,conductor side section 122 c, and conductor top section 122 a), throughinterconnect 1501, and through component conductor 142 x. Also in thepresent example, interconnect 1701 on the bottom of substrate 120 iscoupled to device terminal 1111 of electronic device 130 also along atleast part of the first path, through a route that includes conductor122 x (including conductor bottom section 122 b, conductor side section122 c adjacent sidewall 110 c, and conductor top section 122 a).

Similarly, in a second path adjacent sidewall 110 d of electronic device110, interconnect 1702 on the bottom of substrate 120 is coupled tocomponent terminal 1312 of electronic component 130 through a route thatincludes conductor 122 z (and its respective conductor top section 122a, conductor side section 122 c, and conductor bottom section 122 c),through interconnect 1502, and through component conductor 142 z.

Semiconductor device 100 is presented in its final form, aftersingulation into an individual unit. Such singulation can be achieved,for example by sawing to define the sidewalls of semiconductor device100. In some examples, such singulation can define coplanar portions ofdifferent elements of semiconductor device 100. For example, componentsidewall 130 c of electronic component 130 can be substantially coplanarwith the sidewall of encapsulant 160. In some examples the sidewall ofsubstrate 120, shown in FIG. 2H as an outer end or sidewall ofdielectric bottom section 121 b, is exposed from and substantiallycoplanar with the sidewall of encapsulant 160. In some examples, asshown in FIG. 2H, an outer conductor endpoint of conductor bottomsection 122 b is not exposed from encapsulant 160, but rather covered byit. Such endpoint of conductor bottom section 122 b can be closest tothe sidewall of encapsulant 160 than any other point of conductivebottom section 122 b. There can be other examples where the outer end ofconductor bottom section 122 b could extend further and thus be exposedcoplanar with the sidewall of encapsulant 160.

As a result of the arrangements described above for interconnecting thedifferent conductors of conductive structures 122 and 142, severalsignal paths can be accomplished for semiconductor device 100. Forexample, the path including conductors 122 x and 142 x permitselectronic device 110 and electronic component 130 to be electricallyconnected to each other and to a corresponding interconnect 170 forexternal connection off semiconductor device 100. The path includingconductors 122 y and 142 y permits direct internal connection betweenelectronic devices 110 and electronic component 130. The path includingconductors 122 z and 142 z permits electronic device 130 to beelectrically connected to a corresponding interconnect 170, traversingover but electrically bypassing electronic device 100, for externalconnection off semiconductor device 100. Accordingly, electricalcoupling between top electronic device 130 and external interconnect 170can be achieved without requiring additional formation of a dedicatedvertical via that would otherwise have to extend fully from top tobottom of encapsulant 160 between electronic device 130 and externalinterconnect 170.

The present disclosure includes reference to certain examples, however,it will be understood by those skilled in the art that various changesmay be made and equivalents may be substituted without departing fromthe scope of the disclosure. In addition, modifications may be made tothe disclosed examples without departing from the scope of the presentdisclosure. Therefore, it is intended that the present disclosure not belimited to the examples disclosed, but that the disclosure will includeall examples falling within the scope of the appended claims.

What is claimed is:
 1. A semiconductor device comprising: an electronicdevice comprising: a device top side comprising a device first terminal;a device bottom side opposite the device top side; and a device firstsidewall between the device top side and the device bottom side; and asubstrate comprising: a dielectric material comprising: a dielectric topsection over the device top side, wherein the dielectric top sectioncomprises a dielectric first opening over the device first terminal; adielectric side section over the device first sidewall and continuouswith the dielectric top section; and a dielectric bottom sectioncomprising a lower surface substantially coplanar with the device bottomside and continuous with the dielectric side section; and a firstconductive material comprising: a first conductive top section over thedielectric top section and coupled to the device first terminal throughthe dielectric first opening; a first conductive side section over thedielectric side section and continuous with the first conductive topsection; and a first conductive bottom section over the dielectricbottom section and continuous with the first conductive side section. 2.The semiconductor device of claim 1, wherein: the device bottom sidedefines a device bottom plane; and an upper surface of the firstconductive bottom section is closer to the device bottom plane than alower surface of the first conductive top section.
 3. The semiconductordevice of claim 1, wherein: the first conductive side section issubstantially orthogonal to the first conductive top section and to thefirst conductive bottom section; and the first conductive top sectionand the first conductive bottom section do not substantially overlapeach other.
 4. The semiconductor device of claim 1, further comprising:an encapsulant over the substrate, bounding the device first sidewall,and comprising an encapsulant first sidewall; wherein: the dielectricbottom section comprises a dielectric first end exposed from andsubstantially coplanar with the encapsulant first sidewall; and thefirst conductive bottom section comprises a first conductive endpointcovered by the encapsulant first sidewall, the first conductive endpointbeing closer to the encapsulant first sidewall than any other point ofthe first conductive bottom section.
 5. The semiconductor device ofclaim 1, further comprising: an electronic component comprising: acomponent bottom side; a component first terminal on the componentbottom side; and a component sidewall; and a first internal interconnectover the first conductive top section and coupled to the component firstterminal.
 6. The semiconductor device of claim 5, wherein: theelectronic component comprises: a component dielectric material over thecomponent bottom side and exposing the component first terminal; and acomponent conductive material over the component dielectric material,extending laterally from the component first terminal, and coupling thecomponent first terminal to the first internal interconnect.
 7. Thesemiconductor device of claim 5, further comprising: an encapsulantextending between the component bottom side and the substrate, boundingthe device first sidewall and the first internal interconnect, andcomprising an encapsulant first sidewall; wherein the encapsulant firstsidewall is substantially coplanar to the component sidewall and to asidewall of the dielectric material.
 8. The semiconductor device ofclaim 5, wherein: the component first terminal is coupled to the devicefirst terminal, through the dielectric first opening, by the firstinternal interconnect and the first conductive top section.
 9. Thesemiconductor device of claim 8, wherein: the first internalinterconnect is laterally offset from the component first terminal andfrom the device first terminal.
 10. The semiconductor device of claim 5,further comprising: a first external interconnect on a bottom of thesubstrate; wherein the component first terminal is coupled to the firstexternal interconnect by the first internal interconnect, the firstconductive top section, the first conductive side section, and the firstconductive bottom section of the substrate.
 11. The semiconductor deviceof claim 10, wherein: the component first terminal is coupled to thedevice first terminal, through the dielectric first opening, by thefirst internal interconnect and the first conductive top section. 12.The semiconductor device of claim 1, wherein: the electronic devicecomprises: a device second sidewall between the device top side and thedevice bottom side; the dielectric side section extends over the devicesecond sidewall; and the substrate comprises a second conductivematerial comprising: a second conductive top section over the dielectrictop section; a second conductive side section over the dielectric sidesection, over the device second sidewall, and continuous with the secondconductive top section; and a second conductive bottom section over thedielectric bottom section and continuous with the second conductive sidesection.
 13. The semiconductor device of claim 12, further comprising:an electronic component comprising: a component bottom side; a componentfirst terminal on the component bottom side; a component second terminalon the component bottom side; and a component sidewall; a first internalinterconnect coupled to the component first terminal; a second internalinterconnect coupled to the component second terminal; a first externalinterconnect on a bottom of the substrate; and a second externalinterconnect on the bottom of the substrate; wherein: the componentfirst terminal is coupled to the device first terminal, through thedielectric first opening, by the first internal interconnect and thefirst conductive top section; and the component second terminal iscoupled to the second external interconnect by the second internalinterconnect, the second conductive top section, the second conductiveside section, and the second conductive bottom section.
 14. Asemiconductor device comprising: a semiconductor device top side; asemiconductor device bottom side opposite the semiconductor device topside; and a semiconductor device sidewall between the semiconductordevice top side and the semiconductor device bottom side; an electronicdevice comprising: an electronic device top side; an electronic devicebottom side opposite the electronic device top side; and an electronicdevice sidewall between the electronic device top side and theelectronic device bottom side; a dielectric layer conformal with theelectronic device top side, the electronic device sidewall, and thesemiconductor device bottom side, wherein the dielectric layercomprises: a dielectric layer first upper surface over the electronicdevice top side; and a dielectric layer second upper surface over thesemiconductor device bottom side, wherein a distance between thedielectric layer first upper surface and the semiconductor device bottomside is greater than a distance between the dielectric layer secondupper surface and the semiconductor device bottom side; a firstconductor that extends along the dielectric layer first upper surfaceand the dielectric layer second upper surface; and a protective materialcovering the first conductor and the electronic device.
 15. Thesemiconductor device of claim 14, further comprising: a first dielectricopening in the dielectric layer second upper surface and an externalinterconnect coupled to the first conductor through the first dielectricopening in the dielectric layer second upper surface; an electroniccomponent comprising: a component bottom side; and a component firstterminal on the component bottom side; and a first internal interconnectcoupled to the component first terminal and to the first conductor;wherein the component first terminal is coupled to the externalinterconnect by the first conductor; and wherein the protective materialencapsulates the first internal interconnect and contacts the componentbottom side.
 16. The semiconductor device of claim 15, wherein: theelectronic device comprises an electronic device first terminal on theelectronic device top side; and the component first terminal is coupledto the electronic device first terminal by the first internalinterconnect and the first conductor.
 17. The semiconductor device ofclaim 15, wherein: the protective material comprises a protectivesidewall; the electronic component comprises a component sidewall; andthe semiconductor device sidewall comprises a sidewall of the dielectriclayer, the component sidewall, and the protective sidewall.
 18. Thesemiconductor device of claim 14, wherein the electronic device bottomside is exposed from the dielectric layer at the semiconductor devicebottom side.
 19. A method comprising: providing an electronic devicecomprising: a device top side comprising a device first terminal; adevice bottom side opposite the device top side; and a device firstsidewall between the device top side and the device bottom side; andproviding a substrate comprising: a dielectric material comprising: adielectric top section over the device top side, wherein the dielectrictop section comprises a dielectric first opening over the device firstterminal; a dielectric side section over the device first sidewall andcontinuous with the dielecteic top section; and a dielectric bottomsection comprising a lower surface substantially coplanar with thedevice bottom side and continuous with the dielectric side section; andproviding a first conductive material comprising: a first conductive topsection over the dielectric top section and coupled to the device firstterminal through the dielectric first opening; a first conductive sidesection over the dielectric side section and continuous with the firstconductive top section; and a first conductive bottom section over thedielectric bottom section and continuous with the first conductive sidesection.
 20. The method of claim 19, further comprising: providing anelectronic component comprising: a component bottom side; and acomponent first terminal on the component bottom side; coupling a firstinternal interconnect with the component first terminal and the firstconductive top section; and coupling an external interconnect with thefirst conductive bottom section through the dielectric bottom section;wherein: providing the substrate comprises: providing the dielectricmaterial conformal to a contour of the electronic device; providing thefirst conductive material comprises: providing the first conductivematerial conformal to a contour of the dielectric material and theelectronic device; and providing a portion of the first conductive topsection through the dielectric first opening and coupled to the devicefirst terminal; and coupling the external interconnect comprises:coupling the component first terminal with the external interconnect bythe first internal interconnect, the first conductive top section, thefirst conductive side section, and the first conductive bottom section.21. The method of claim 19, further comprising: providing an encapsulantover the first conductive material, the dielectric material, and theelectronic device; wherein: providing the substrate comprises: providingthe dielectric material conformal to a contour of the electronic device;providing the first conductive material comprises: providing the firstconductive material conformal to a contour of the dielectric materialand the electronic device; and providing a portion of the firstconductive material top section through the dielectric first opening andcoupled to the device first terminal; and providing the encapsulantcomprises: providing a bottom of the encapsulant conformal to the firstconductive top section, the first conductive side section, and the firstconductive bottom section.